
QUOTE
The liquid metal is a key component in Danamics cooling systems. Liquid metal has two major advantages when cooling high power density heat sources:
Firstly it has superior thermo physical properties that decrease temperature - and temperature non–uniformity - on die and across chips.
Secondly the electrical properties of the liquid metal enables efficient, reliable and ultra compact electromagnetic pumping without the use of moving parts, shafts, seals, etc.
Firstly it has superior thermo physical properties that decrease temperature - and temperature non–uniformity - on die and across chips.
Secondly the electrical properties of the liquid metal enables efficient, reliable and ultra compact electromagnetic pumping without the use of moving parts, shafts, seals, etc.
http://www.danamics.com/danamics-lm10.aspx
Sounds interesting, I wonder what element/compound/mixture they are using and how much it will cost
